UltraPrep Lapping Film, Plain Backed, 30µm, 8in

UltraPrep Lapping Film, Plain Backed, 30µm, 8in

Item No: B156831

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Ultra-Prep diamond lapping films are designed for fine grinding of hard materials such as ceramic, microelectronic devices, wafers, optical fibers, petrographic specimens and other materials.

QTY/EA 5
ABRASIVE MATERIAL Diamond
BACKING Plain Backed
DIMENSIONS 8 in [203 mm]
MICRON SIZE 30 �m
PRODUCT FAMILY UltraPrep Lapping Film

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