UltraPrep Lapping Film, Plain Backed, 1µm, 8in - JH Technologies

UltraPrep Lapping Film, Plain Backed, 1um, 8in

Item No: B-156802

Login to order online

Click SDS for details


Ultra-Prep diamond lapping films are designed for fine grinding of hard materials such as ceramic, microelectronic devices, wafers, optical fibers, petrographic specimens and other materials.

QTY/EA 5
ABRASIVE MATERIAL Diamond
BACKING Plain Backed
DIMENSIONS 8 in [203 mm]
MICRON SIZE 1um
PRODUCT FAMILY UltraPrep Lapping Film

We Also Recommend